Panasonic Flip Chip Bonder MDP-300 | Microelectronics Solutions Panasonic’s process-flexible, flip chip bonder combines flip chip, thermosonic, and thermocompression bonding in a single, small footprint solution. ... Our newest process-flexible, flip chip bonder combines flip chip, thermosonic, and thermocompression b
Flip Chip Bonder - ASM Pacific Technology Ltd Flip Chip Bonder. High speed, precise and flexible solution to Flip Chip applications. Flux Dispensing /. Dual Head Flux Dipping FC. Thermo-compression.
Flip-Chip Bonder - 技鼎股份有限公司 Flip-Chip Bonder. ... Flip-Chip Bonder (Flipchip Bonder-A110). 全自動量產型Flip Chip bonder，應用於高階覆晶封裝技術. more. 產品應用. 產品規格. 聯絡方式 ...
AFC Plus- Die Bonder and Flip Chip Bonder - AMICRA ... The AFC Plus is a die bonder and flip chip bonder system with high precision and placement accuracy (+/ 0.5 µm), a modular machine concept, a flip chip option ...
NovaPlus- Die Bonder and Flip Chip Bonder - AMICRA ... Nova Plus is a die bonder and flip chip bonder system by AMICRA with extremely high accuracy (+/- 2,5 µm), multi-chip capability, a modular machine concept ...
Flip Chip Bonder (for SiP/COC/CSP ) FC3000 - Toray ... Flip chip bonder which can be switched to either the thermo-compression process or ultrasonic bonding process with a change-over.
Flip Chip Bonder (for SiP/COC/CSP) FC3000S - Toray ... Flip Chip Bonder (for SiP/COC/CSP) FC3000S. Features. A semi-automatic machine, suited for conducting R&D work and small amount of production.
AMICRA AFC Plus Die Bonder / Flip Chip Bonder- High ... AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and ...
Flip Chip Bonder - Global Home - Panasonic Flip Chip Bonder / Equipment to bond bare chips with bumps on electrodes ... Panasonic Factory Solutions > Device Related Systems > Flip Chip Bonder.
Flip Chip Bonder MDP-300 - Panasonic Factory Automation Panasonic's process-flexible, flip chip bonder combines flip chip, thermosonic, and thermocompression bonding in a single, small footprint solution.
